A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering A Kunwar, L An, J Liu, S Shang, P Råback, H Ma, X Song
Journal of Materials Science & Technology 50, 115-127, 2020
33 2020 Synthesis of Cu@ Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity S Shang, A Kunwar, Y Wang, X Qi, H Ma, Y Wang
Applied Physics A 124, 1-8, 2018
33 2018 Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5 Ag0. 5/Cu joints A Kunwar, S Shang, P Råback, Y Wang, J Givernaud, J Chen, H Ma, ...
Microelectronics Reliability 80, 55-67, 2018
33 2018 Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows HR Ma, A Kunwar, SY Shang, CR Jiang, YP Wang, HT Ma, N Zhao
Intermetallics 96, 1-12, 2018
22 2018 Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling A Kunwar, B Guo, S Shang, P Råback, Y Wang, J Chen, H Ma, X Song, ...
Intermetallics 93, 186-196, 2018
20 2018 Electrochemical migration behavior of Sn-based lead-free solder X Qi, H Ma, C Wang, S Shang, X Li, Y Wang, H Ma
Journal of Materials Science: Materials in Electronics 30, 14695-14702, 2019
18 2019 Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint S Shang, Y Wang, Y Wang, H Ma, A Kunwar
Microelectronic Engineering 208, 47-53, 2019
17 2019 Size effect on interface reaction of Sn–x Cu/Cu solder joints during multiple reflows R Huang, H Ma, S Shang, A Kunwar, Y Wang, H Ma
Journal of Materials Science: Materials in Electronics 30, 4359-4369, 2019
14 2019 Formation of nanoporous anodized tin oxide films in electrolyte containing F− and S2− J Cao, C Wang, Z Gao, S Shang, Q Gu, N Gao, Y Wang, H Ma
ECS Journal of Solid State Science and Technology 9 (10), 104010, 2020
12 2020 Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn–xCu solders during multiple reflows H Ma, H Ma, A Kunwar, S Shang, Y Wang, J Chen, M Huang, N Zhao
Journal of Materials Science: Materials in Electronics 29, 602-613, 2018
12 2018 Effect of the S Shang, A Kunwar, J Yao, Y Wang, H Ma, Y Wang
Metals and Materials International 25 (2), 499-507, 2019
11 2019 Geometrical effects of Cu@ Ag core–shell nanoparticles treated flux on the growth behaviour of intermetallics in Sn/Cu solder joints S Shang, A Kunwar, Y Wang, J Yao, Y Wu, H Ma, Y Wang
Electronic Materials Letters 15, 253-265, 2019
9 2019 Pronounced electromigration of GaInSn/Cu interconnects under super low critical current density Z Gao, C Dong, S Shang, M Huang, H Ma, Y Wang
Materials Letters 300, 130137, 2021
7 2021 Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn–xTiO2 composite solder Z Liu, H Ma, S Shang, Y Wang, X Li, H Ma
Journal of Materials Science: Materials in Electronics 30, 18828-18837, 2019
7 2019 Modelling the melting of Sn0. 7Cu solder using the enthalpy method A Kunwar, J Givernaud, H Ma, Z Meng, S Shang, Y Wang, H Ma
2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016
7 2016 Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface Z Zhu, H Ma, S Shang, H Ma, Y Wang, X Li
Journal of Materials Science: Materials in Electronics 30, 15964-15971, 2019
6 2019 Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface S Shang, A Kunwar, Y Wang, L Qu, H Ma, Y Wang
Journal of Materials Science: Materials in Electronics 30, 2872-2887, 2019
6 2019 Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints reflowed with Cu nanoparticles doped flux S Shang, A Kunwar, J Yao, H Ma, Y Wang
Thin Solid Films 669, 198-207, 2019
6 2019 All-round suppression of Cu6 Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles S Shang, A Kunwar, J Yao, Y Wang, N Zhao, M Huang, H Ma
Journal of Materials Science: Materials in Electronics 29, 15966-15972, 2018
4 2018 Effects of Cu nanoparticles doped flux on the microstructure of IMCs between Sn solder and Cu substrate S Shang, A Kunwar, Y Wu, H Ma
2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017
3 2017 
Anil KunwarSilesian University of TechnologyBestätigte E-Mail-Adresse bei polsl.pl
