Ferroelectric materials for microwave tunable applications AK Tagantsev, VO Sherman, KF Astafiev, J Venkatesh, N Setter
Journal of electroceramics 11, 5-66, 2003
1714 2003 Design issues and considerations for low-cost 3-D TSV IC technology G Van der Plas, P Limaye, I Loi, A Mercha, H Oprins, C Torregiani, S Thijs, ...
IEEE Journal of Solid-State Circuits 46 (1), 293-307, 2010
388 2010 Ferroelectric-dielectric tunable composites VO Sherman, AK Tagantsev, N Setter, D Iddles, T Price
Journal of applied physics 99 (7), 2006
195 2006 Relaxor ferroelectricity in strained epitaxial SrTiO3 thin films on DyScO3 substrates MD Biegalski, Y Jia, DG Schlom, S Trolier-McKinstry, SK Streiffer, ...
Applied physics letters 88 (19), 2006
124 2006 Tuning of direct current bias-induced resonances in micromachined Ba0. 3Sr0. 7TiO3 thin-film capacitors A Noeth, T Yamada, VO Sherman, P Muralt, AK Tagantsev, N Setter
Journal of Applied Physics 102 (11), 2007
74 2007 Effects of glass additions on the microstructure and dielectric properties of barium strontium titanate (BST) ceramics D Zhang, TW Button, VO Sherman, AK Tagantsev, T Price, D Iddles
Journal of the European Ceramic Society 30 (2), 407-412, 2010
64 2010 Synthesis and dielectric characterization of potassium niobate tantalate ceramics J Venkatesh, V Sherman, N Setter
Journal of the American Ceramic Society 88 (12), 3397-3404, 2005
56 2005 Digital reflection-type phase shifter based on a ferroelectric planar capacitor V Sherman, K Astafiev, N Setter, A Tagantsev, O Vendik, I Vendik, ...
IEEE microwave and wireless components letters 11 (10), 407-409, 2001
56 2001 Can the addition of a dielectric improve the figure of merit of a tunable material? KF Astafiev, VO Sherman, AK Tagantsev, N Setter
Journal of the European Ceramic Society 23 (14), 2381-2386, 2003
52 2003 Epitaxial∕ amorphous Ba0. 3Sr0. 7TiO3 film composite structure for tunable applications T Yamada, VO Sherman, A Nöth, P Muralt, AK Tagantsev, N Setter
Applied physics letters 89 (3), 2006
49 2006 Strain relaxation of epitaxial SrTiO3 thin films on LaAlO3 by two-step growth technique T Yamada, KF Astafiev, VO Sherman, AK Tagantsev, P Muralt, N Setter
Applied physics letters 86 (14), 2005
49 2005 High-efficiency polymer-based direct multi-jet impingement cooling solution for high-power devices T Wei, H Oprins, V Cherman, J Qian, I De Wolf, E Beyne, M Baelmans
IEEE Transactions on Power Electronics 34 (7), 6601-6612, 2018
48 2018 In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs I De Wolf, V Simons, V Cherman, R Labie, B Vandevelde, E Beyne
2012 IEEE 62nd Electronic Components and Technology Conference, 331-337, 2012
45 2012 Model of a low-permittivity and high-tunability ferroelectric based composite VO Sherman, AK Tagantsev, N Setter
Applied physics letters 90 (16), 2007
43 2007 MEMS packaging and reliability: An undividable couple HAC Tilmans, J De Coster, P Helin, V Cherman, A Jourdain, P De Moor, ...
Microelectronics Reliability 52 (9-10), 2228-2234, 2012
41 2012 Numerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stack H Oprins, VO Cherman, B Vandevelde, G Van der Plas, P Marchal, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 1081-1088, 2012
41 2012 In-Plane and Out-of-Plane Ferroelectric Instabilities in Epitaxial Films T Yamada, J Petzelt, AK Tagantsev, S Denisov, D Noujni, PK Petrov, ...
Physical review letters 96 (15), 157602, 2006
38 2006 High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler T Tiwei, H Oprins, V Cherman, G Van der Plas, I De Wolf, E Beyne, ...
2017 IEEE International Electron Devices Meeting (IEDM), 32.5. 1-32.5. 4, 2017
37 2017 Narrowband Y-Ba-Cu-O filter with quasi-elliptic characteristic IB Vendik, AN Deleniv, VO Sherman, AA Svishchev, VV Kondratiev, ...
IEEE transactions on applied superconductivity 11 (1), 477-480, 2001
37 2001 Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip TW Wei, H Oprins, V Cherman, G Van der Plas, I De Wolf, E Beyne, ...
Applied thermal engineering 152, 308-318, 2019
36 2019