| Multi-objective optimization to improve both thermal and device performance of a nonuniformly powered micro-architecture S Karajgikar, D Agonafer, K Ghose, B Sammakia, C Amon, ... | 21 | 2010 |
| Thermal design optimization of a package on package AR Menon, S Karajgikar, D Agonafer 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management …, 2009 | 20 | 2009 |
| Electro-thermal analysis of in-plane micropump S Karajgikar, S Rao, J Sin, D Agonafer, JC Chiao, D Popa, H Stephanou IEEE Transactions on Components and packaging Technologies 33 (2), 329-339, 2010 | 17 | 2010 |
| Effect of CRAC location on fixed rack layout V Bedekar, S Karajgikar, D Agonafer, M Iyyengar, R Schmidt Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 17 | 2006 |
| Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center V Shalom Simon, H Modi, KB Sivaraju, P Bansode, S Saini, P Shahi, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 13 | 2022 |
| Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance S Karajgikar, D Agonafer, K Ghose, B Sammakia, C Amon, ... International Electronic Packaging Technical Conference and Exhibition 43604 …, 2009 | 13 | 2009 |
| Achieving energy efficient data centers using cooling path management coupled with ASHRAE standards M Green, S Karajgikar, P Vozza, N Gmitter, D Dyer 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012 | 12 | 2012 |
| Cooling of Data Centers Using Airside Economizers S Karajgikar, V Mulay, D Agonafer, R Schmidt International Electronic Packaging Technical Conference and Exhibition 43604 …, 2009 | 9 | 2009 |
| Computational study of hybrid cooling solution for thermal management of data centers V Mulay, S Karajgikar, D Agonafer, R Schmidt, M Iyengar, J Nigen International Electronic Packaging Technical Conference and Exhibition 42770 …, 2007 | 9 | 2007 |
| Energy minimization based fan configuration for double walled telecommunication cabinet with solar load B Muralidharan, FAI Mariam, S Karajgikar, D Agonafer, M Hendrix 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010 | 8 | 2010 |
| Parametric study of hybrid cooling solution for thermal management of Data Centers V Mulay, S Karajgikar, D Agonafer, R Schmidt, M Iyengar ASME International Mechanical Engineering Congress and Exposition 43025, 519-526, 2007 | 8 | 2007 |
| Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations KB Sivaraju, P Bansode, G Gupta, J Lamotte-Dawaghreh, S Saini, ... International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 4 | 2022 |
| Impact of area contact between sensor bulb and evaporator return line on modular refrigeration unit: Computational and experimental S Karajgikar, N Lakhkar, D Agonafer, R Schmidt J. Heat Transfer 127 (1), 95-100, 2005 | 4 | 2005 |
| Pump driven liquid cooling module with tower fins C Chen, SS Karajgikar US Patent 10,874,034, 2020 | 3 | 2020 |
| Mechanical design optimization of a package on package AR Menon, N Lakhkar, S Karajgikar, D Agonafer International Electronic Packaging Technical Conference and Exhibition 43604 …, 2009 | 3 | 2009 |
| Rear Door Heat Exchanger Cooling Performance in Telecommunication Data Centers VNP Mynampati, S Karajgikar, I Sheerah, D Agonafer, S Novotny, ... ASME International Mechanical Engineering Congress and Exposition 44281, 405-410, 2010 | 2 | 2010 |
| Effect of flip chip package architecture on stresses in the bump passivation opening S Karajgikar, V Nagaraj, D Agonafer 2009 59th Electronic Components and Technology Conference, 936-942, 2009 | 2 | 2009 |
| Thermal Management of Telecommunication Cabinets Using Thermoelectric Coolers FAI Mariam, V Mulay, S Karajgikar, D Agonafer, M Hendrix ASME International Mechanical Engineering Congress and Exposition 43826 …, 2009 | 2 | 2009 |
| Flip chip back end design parameters to reduce bump electromigration S Karajgikar, V Nagaraj, D Agonafer, S Pekin 2008 58th Electronic Components and Technology Conference, 347-353, 2008 | 2 | 2008 |
| The Impact of Area Contact Between Sensor Bulb and Evaporator Return Line in a Modular Refrigeration Unit: Part I—Computational Study N Lakhkar, S Karajgikar, D Agonafer, R Schmidt ASME International Mechanical Engineering Congress and Exposition 37149, 651-656, 2003 | 2 | 2003 |
