Philippe M. Vereecken
Philippe M. Vereecken
Fellow/Professor imec/KULeuven
Bestätigte E-Mail-Adresse bei
Zitiert von
Zitiert von
Dynamic microscopy of nanoscale cluster growth at the solid–liquid interface
MJ Williamson, RM Tromp, PM Vereecken, R Hull, FM Ross
Nature materials 2 (8), 532-536, 2003
Chemical vapour deposition of zeolitic imidazolate framework thin films
I Stassen, M Styles, G Grenci, HV Gorp, W Vanderlinden, SD Feyter, ...
Nature materials 15 (3), 304-310, 2016
The chemistry of additives in damascene copper plating
PM Vereecken, RA Binstead, H Deligianni, PC Andricacos
IBM Journal of Research and Development 49 (1), 3-18, 2005
Quantifying electrochemical nucleation and growth of nanoscale clusters using real-time kinetic data
A Radisic, PM Vereecken, JB Hannon, PC Searson, FM Ross
Nano Letters 6 (2), 238-242, 2006
Liner materials for direct electrodeposition of Cu
MW Lane, CE Murray, FR McFeely, PM Vereecken, R Rosenberg
Applied physics letters 83 (12), 2330-2332, 2003
Electrochemical Deposition of Copper on n‐Si/TiN
G Oskam, PM Vereecken, PC Searson
Journal of The Electrochemical Society 146 (4), 1436-1441, 1999
Plasma-enhanced chemical vapour deposition growth of Si nanowires with low melting point metal catalysts: an effective alternative to Au-mediated growth
F Iacopi, PM Vereecken, M Schaekers, M Caymax, N Moelans, ...
Nanotechnology 18 (50), 505307, 2007
Particle codeposition in nanocomposite films
PM Vereecken, I Shao, PC Searson
Journal of the Electrochemical Society 147 (7), 2572, 2000
Solvent-free synthesis of supported ZIF-8 films and patterns through transformation of deposited zinc oxide precursors
I Stassen, N Campagnol, J Fransaer, P Vereecken, D De Vos, R Ameloot
CrystEngComm 15 (45), 9308-9311, 2013
The morphology and nucleation kinetics of copper islands during electrodeposition
A Radisic, PM Vereecken, PC Searson, FM Ross
Surface science 600 (9), 1817-1826, 2006
Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects
S Masahito, Y Kashiwagi, Y Li, K Arstila, O Richard, DJ Cott, M Heyns, ...
Nanotechnology 22 (8), 085302, 2011
Towards metal–organic framework based field effect chemical sensors: UiO-66-NH 2 for nerve agent detection
I Stassen, B Bueken, H Reinsch, JFM Oudenhoven, D Wouters, J Hajek, ...
Chemical Science, 2016
Advances in 3D Thin‐Film Li‐Ion Batteries
S Moitzheim, B Put, PM Vereecken
Advanced Materials Interfaces, 1900805, 2019
Copper electrodeposition for nanofabrication of electronics devices
K Kondo, RN Akolkar, DP Barkey, M Yokoi
Springer, 2014
Kinetics of particle codeposition of nanocomposites
I Shao, PM Vereecken, RC Cammarata, PC Searson
Journal of the Electrochemical Society 149 (11), C610, 2002
A USB-controlled potentiostat/galvanostat for thin-film battery characterization
T Dobbelaere, PM Vereecken, C Detavernier
HardwareX, 2017
Selective capping of copper wiring
PC Andricacos, ST Chen, JM Cotte, H Deligianni, M Krishnan, WT Tseng, ...
US Patent 7,008,871, 2006
Synthesis and Characterization of Particle-reinforced Ni/Al2O3 Nanocomposites
I Shao, PM Vereecken, CL Chien, PC Searson, RC Cammarata
Journal of materials research 17 (6), 1412-1418, 2002
Copper plating for 3D interconnects
A Radisic, O Lühn, J Vaes, S Armini, Z El-Mekki, D Radisic, W Ruythooren, ...
ECS Transactions 25 (38), 119-125, 2010
Anodic etching of n-GaN epilayer into porous GaN and its photoelectrochemical properties
WJ Tseng, DH van Dorp, RR Lieten, PM Vereecken, G Borghs
The Journal of Physical Chemistry C 118 (51), 29492-29498, 2014
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