| Copper deposition in the presence of polyethylene glycol: I. Quartz crystal microbalance study JJ Kelly, AC West Journal of The Electrochemical Society 145 (10), 3472, 1998 | 457 | 1998 |
| Leveling and microstructural effects of additives for copper electrodeposition JJ Kelly, C Tian, AC West Journal of the Electrochemical Society 146 (7), 2540, 1999 | 351 | 1999 |
| A superfilling model that predicts bump formation AC West, S Mayer, J Reid Electrochemical and Solid-State Letters 4 (7), C50, 2001 | 335 | 2001 |
| Effect of electrolyte composition on lithium dendrite growth O Crowther, AC West Journal of the Electrochemical Society 155 (11), A806, 2008 | 326 | 2008 |
| Copper deposition in the presence of polyethylene glycol: II. Electrochemical impedance spectroscopy JJ Kelly, AC West Journal of The Electrochemical Society 145 (10), 3477, 1998 | 282 | 1998 |
| Advancements in the treatment and processing of electronic waste with sustainability: a review of metal extraction and recovery technologies E Hsu, K Barmak, AC West, AHA Park Green Chemistry 21 (5), 919-936, 2019 | 256 | 2019 |
| Three-additive model of superfilling of copper Y Cao, P Taephaisitphongse, R Chalupa, AC West Journal of The Electrochemical Society 148 (7), C466, 2001 | 221 | 2001 |
| Electrochemical and fill studies of a multicomponent additive package for copper deposition P Taephaisitphongse, Y Cao, AC West Journal of the Electrochemical Society 148 (7), C492, 2001 | 219 | 2001 |
| Theory of filling of high‐aspect ratio trenches and vias in presence of additives AC West Journal of the Electrochemical Society 147 (1), 227, 2000 | 196 | 2000 |
| Influence of rib spacing in proton-exchange membrane electrode assemblies AC West, TF Fuller Journal of applied electrochemistry 26 (6), 557-565, 1996 | 192 | 1996 |
| Chondrocyte intracellular calcium, cytoskeletal organization, and gene expression responses to dynamic osmotic loading PG Chao, AC West, CT Hung American Journal of Physiology-Cell Physiology 291 (4), C718-C725, 2006 | 155 | 2006 |
| Pulse reverse copper electrodeposition in high aspect ratio trenches and vias AC West, CC Cheng, BC Baker Journal of The Electrochemical Society 145 (9), 3070, 1998 | 143 | 1998 |
| Composite electrolyte membranes for high temperature CO2 separation JL Wade, C Lee, AC West, KS Lackner Journal of Membrane Science 369 (1-2), 20-29, 2011 | 142 | 2011 |
| AC impedance study of anodically formed salt films on iron in chloride solution RD Grimm, AC West, D Landolt Journal of the electrochemical society 139 (6), 1622, 1992 | 141 | 1992 |
| Corrosion and embrittlement in high-strength wires of suspension bridge cables R Betti, AC West, G Vermaas, Y Cao Journal of Bridge Engineering 10 (2), 151-162, 2005 | 126 | 2005 |
| Accelerated corrosion and embrittlement of high-strength bridge wire SC Barton, GW Vermaas, PF Duby, AC West, R Betti Journal of materials in civil engineering 12 (1), 33-38, 2000 | 120 | 2000 |
| Leveling of 200 nm features by organic additives JJ Kellya, AC West Electrochemical and solid-state letters 2 (11), 561, 1999 | 118 | 1999 |
| Copper electropolishing in concentrated phosphoric acid: I. Experimental findings R Vidal, AC West Journal of the electrochemical society 142 (8), 2682, 1995 | 109 | 1995 |
| Systems and methods of blood-based therapies having a microfluidic membraneless exchange device EF Leonard, AC West, NC Shaplely, Z Tang US Patent 7,588,550, 2009 | 107 | 2009 |
| SPS adsorption and desorption during copper electrodeposition and its impact on PEG adsorption MJ Willey, AC West Journal of The Electrochemical Society 154 (3), D156, 2007 | 107 | 2007 |
