| An experimental and numerical study of plunging wave impact on a box-shape structure B Yan, M Luo, W Bai Marine Structures 66, 272-287, 2019 | 51 | 2019 |
| Numerical investigation of wave forces on two side-by-side non-identical boxes in close proximity under wave actions SC Jiang, W Bai, PW Cong, B Yan Marine Structures 63, 16-44, 2019 | 45 | 2019 |
| Higher-order harmonic induced wave resonance for two side-by-side boxes in close proximity SC Jiang, W Bai, B Yan Physics of Fluids 33 (10), 2021 | 38 | 2021 |
| Three-dimensional sloshing in a scaled membrane LNG tank under combined roll and pitch excitations M Luo, X Wang, X Jin, B Yan Ocean Engineering 211, 107578, 2020 | 28 | 2020 |
| Study on hydro-kinematic characteristics of green water over different fixed decks using immersed boundary method B Yan, W Bai, L Qian, Z Ma Ocean Engineering 164, 74-86, 2018 | 12 | 2018 |
| Numerical simulations for internal baffle effect on suppressing sway-sloshing coupled motion response SC Jiang, A Feng, B Yan Ocean Engineering 250, 110513, 2022 | 11 | 2022 |
| A three-dimensional immersed boundary method based on an algebraic forcing-point-searching scheme for water impact problems B Yan, W Bai, SC Jiang, P Cong, D Ning, L Qian Ocean Engineering 233, 109189, 2021 | 5 | 2021 |
| An improved immersed boundary method with new forcing point searching scheme for simulation of bodies in free surface flows B Yan, W Bai, ST Quek Communications in Computational Physics 24 (3), 830-859, 2018 | 4 | 2018 |
| 波浪对淹没水平圆柱作用的非线性数值模拟 严斌， 林红星， 宁德志 海洋科学进展 31 (3), 319-325, 2013 | 2 | 2013 |
| Thermal Performance Analysis of Impingement Liquid Cooling Technology Using Ansys Icepak H Yang, B Yan, et al Ansys Simulation World 2024, 1-8, 2024 | | 2024 |
| Design Optimization and Performance Evaluation of Direct Liquid Single-Phase Jet Impingement Heat Sink for High-Performance Computing Chips K Lin, B Yan, X Chen, S Ma, et al 25th The International Conference on Electronic Packaging Technology, 1-6, 2024 | | 2024 |
| Improvement of Warping Simulation Accuracy and Influence Factors Analysis in FCBGA Package YB Wang, B Yan, et al Semiconductor Equipment and Materials International（China）, 1-2, 2024 | | 2024 |
| A Modularized Thermal Test Chip Design and Verification JJ Sun, B Yan, et al Semiconductor Equipment and Materials International（China）, 2024 | | 2024 |
| Theoretical models on interfacial thermal conductance of nanoscale solid interfaces in chips: a mini review Z Zong, X Chen, Y Nuo, Y Bin, et al Chinese Physics Letters, 2024 | | 2024 |
| Thermal Resistance Simulation Analysis and Test Research of Wire Bond Ball Grid Array Package F Qu, B Yan 24th International Conference on Electronic Packaging Technology (ICEPT), 1-5, 2023 | | 2023 |
| 先进封装材料(散热材料&基板材料) B Yan CMC中国材料大会 - 集成电路材料产业发展论坛, 1-10, 2023 | | 2023 |
| High performance TIM1 for CoWoS Package JJ Sun, B Yan TSMC 2022 China OIP Ecosystem Forum, 1-10, 2022 | | 2022 |
| Accurate 3DIC thermal simulation for BEOL Influence study H Yang, B Yan, et al 2022 IEEE International Conference on Integrated Circuits, Technologies and …, 2022 | | 2022 |
| Numerical Simulation of Greenwater on the Deck of Offshore Structures Using a Combined Level Set Immersed Boundary Method Y Bin PQDT-Global, 2018 | | 2018 |
| Green water over a fixed deck by immersed boundary method B Yan, W Bai, ST Quek 10th International Workshop on Ship and Marine Hydrodynmics, 1-10, 2017 | | 2017 |
Wei BaiReader, Manchester Metropolitan UniversityBestätigte E-Mail-Adresse bei mmu.ac.uk
