In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper H Ma, A Kunwar, J Sun, B Guo, H Ma
Scripta Materialia 107, 88-91, 2015
46 2015 A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering A Kunwar, L An, J Liu, S Shang, P Råback, H Ma, X Song
Journal of Materials Science & Technology 50, 115-127, 2020
42 2020 Synthesis of Cu@ Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity S Shang, A Kunwar, Y Wang, X Qi, H Ma, Y Wang
Applied Physics A 124, 1-8, 2018
40 2018 Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints B Guo, A Kunwar, N Zhao, J Chen, Y Wang, H Ma
Materials research bulletin 99, 239-248, 2018
40 2018 Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5 Ag0. 5/Cu joints A Kunwar, S Shang, P Råback, Y Wang, J Givernaud, J Chen, H Ma, ...
Microelectronics Reliability 80, 55-67, 2018
40 2018 In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process L Qu, HT Ma, HJ Zhao, A Kunwar, N Zhao
Applied surface science 305, 133-138, 2014
39 2014 Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interface A Kunwar, J Hektor, S Nomoto, YA Coutinho, N Moelans
International Journal of Mechanical Sciences 184, 105843, 2020
36 2020 3D printed biomedical devices and their applications: A review on state-of-the-art technologies, existing challenges, and future perspectives HB Mamo, M Adamiak, A Kunwar
Journal of the mechanical behavior of biomedical materials 143, 105930, 2023
33 2023 Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface A Kunwar, YA Coutinho, J Hektor, H Ma, N Moelans
Journal of Materials Science & Technology 59, 203-219, 2020
30 2020 On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient A Kunwar, H Ma, H Ma, J Sun, N Zhao, M Huang
Materials Letters 172, 211-215, 2016
30 2016 Fabrication of cerium myristate coating for a mechanochemically robust modifier-free superwettability system to enhance the corrosion resistance on 316L steel by one-step … MM Hussain, H Ma, M Huang, Z Gao, J Cao, C Wang, C Dong, Y Wang, ...
Surface and Coatings Technology 398, 125970, 2020
28 2020 Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows HR Ma, A Kunwar, SY Shang, CR Jiang, YP Wang, HT Ma, N Zhao
Intermetallics 96, 1-12, 2018
26 2018 A study on the physical properties and interfacial reactions with Cu substrate of rapidly solidified Sn-3.5 Ag lead-free solder HT Ma, J Wang, L Qu, N Zhao, A Kunwar
Journal of electronic materials 42, 2686-2695, 2013
26 2013 Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling A Kunwar, B Guo, S Shang, P Råback, Y Wang, J Chen, H Ma, X Song, ...
Intermetallics 93, 186-196, 2018
22 2018 Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles during multiple reflows H Ma, A Kunwar, R Huang, J Chen, Y Wang, N Zhao, H Ma
Intermetallics 90, 90-96, 2017
22 2017 Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint S Shang, Y Wang, Y Wang, H Ma, A Kunwar
Microelectronic Engineering 208, 47-53, 2019
18 2019 Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage B Guo, A Kunwar, C Jiang, N Zhao, J Sun, J Chen, Y Wang, M Huang, ...
Journal of Materials Science: Materials in Electronics 29, 589-601, 2018
18 2018 On the thickness of Cu6 Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration A Kunwar, H Ma, H Ma, B Guo, Z Meng, N Zhao, M Huang
Journal of Materials Science: Materials in Electronics 27, 7699-7706, 2016
18 2016 Size effect on interface reaction of Sn–x Cu/Cu solder joints during multiple reflows R Huang, H Ma, S Shang, A Kunwar, Y Wang, H Ma
Journal of Materials Science: Materials in Electronics 30, 4359-4369, 2019
16 2019 Effect of the S Shang, A Kunwar, J Yao, Y Wang, H Ma, Y Wang
Metals and Materials International 25 (2), 499-507, 2019
14 2019 
Shengyan ShangPh D student, Dalian University of TechnologyBestätigte E-Mail-Adresse bei mail.dlut.edu.cn
