Folgen
Anil Kunwar
Titel
Zitiert von
Zitiert von
Jahr
In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper
H Ma, A Kunwar, J Sun, B Guo, H Ma
Scripta Materialia 107, 88-91, 2015
462015
In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process
L Qu, HT Ma, HJ Zhao, A Kunwar, N Zhao
Applied surface science 305, 133-138, 2014
392014
A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering
A Kunwar, L An, J Liu, S Shang, P Råback, H Ma, X Song
Journal of Materials Science & Technology 50, 115-127, 2020
372020
Synthesis of Cu@ Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity
S Shang, A Kunwar, Y Wang, X Qi, H Ma, Y Wang
Applied Physics A 124, 1-8, 2018
372018
Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints
B Guo, A Kunwar, N Zhao, J Chen, Y Wang, H Ma
Materials research bulletin 99, 239-248, 2018
362018
Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5 Ag0. 5/Cu joints
A Kunwar, S Shang, P Råback, Y Wang, J Givernaud, J Chen, H Ma, ...
Microelectronics Reliability 80, 55-67, 2018
362018
Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interface
A Kunwar, J Hektor, S Nomoto, YA Coutinho, N Moelans
International Journal of Mechanical Sciences 184, 105843, 2020
352020
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient
A Kunwar, H Ma, H Ma, J Sun, N Zhao, M Huang
Materials Letters 172, 211-215, 2016
302016
Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface
A Kunwar, YA Coutinho, J Hektor, H Ma, N Moelans
Journal of Materials Science & Technology 59, 203-219, 2020
292020
A study on the physical properties and interfacial reactions with Cu substrate of rapidly solidified Sn-3.5 Ag lead-free solder
HT Ma, J Wang, L Qu, N Zhao, A Kunwar
Journal of electronic materials 42, 2686-2695, 2013
272013
Fabrication of cerium myristate coating for a mechanochemically robust modifier-free superwettability system to enhance the corrosion resistance on 316L steel by one-step …
MM Hussain, H Ma, M Huang, Z Gao, J Cao, C Wang, C Dong, Y Wang, ...
Surface and Coatings Technology 398, 125970, 2020
262020
Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows
HR Ma, A Kunwar, SY Shang, CR Jiang, YP Wang, HT Ma, N Zhao
Intermetallics 96, 1-12, 2018
252018
3D printed biomedical devices and their applications: A review on state-of-the-art technologies, existing challenges, and future perspectives
HB Mamo, M Adamiak, A Kunwar
Journal of the mechanical behavior of biomedical materials, 105930, 2023
232023
Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles during multiple reflows
H Ma, A Kunwar, R Huang, J Chen, Y Wang, N Zhao, H Ma
Intermetallics 90, 90-96, 2017
222017
Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling
A Kunwar, B Guo, S Shang, P Råback, Y Wang, J Chen, H Ma, X Song, ...
Intermetallics 93, 186-196, 2018
212018
Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage
B Guo, A Kunwar, C Jiang, N Zhao, J Sun, J Chen, Y Wang, M Huang, ...
Journal of Materials Science: Materials in Electronics 29, 589-601, 2018
182018
Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint
S Shang, Y Wang, Y Wang, H Ma, A Kunwar
Microelectronic Engineering 208, 47-53, 2019
172019
On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration
A Kunwar, H Ma, H Ma, B Guo, Z Meng, N Zhao, M Huang
Journal of Materials Science: Materials in Electronics 27, 7699-7706, 2016
172016
Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints
H Ma, A Kunwar, B Guo, J Sun, C Jiang, Y Wang, X Song, N Zhao, H Ma
Applied Physics A 122, 1-10, 2016
152016
Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling …
B Guo, H Ma, C Jiang, Y Wang, A Kunwar, N Zhao, M Huang
Journal of Materials Science: Materials in Electronics 28, 5398-5406, 2017
142017
Das System kann den Vorgang jetzt nicht ausführen. Versuchen Sie es später erneut.
Artikel 1–20