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Yi Zhong/钟毅
Yi Zhong/钟毅
Loughborough University
Bestätigte E-Mail-Adresse bei mail.dlut.edu.cn
Titel
Zitiert von
Zitiert von
Jahr
Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient
N Zhao, Y Zhong, ML Huang, HT Ma, W Dong
Scientific reports 5 (1), 13491, 2015
1132015
Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient
N Zhao, Y Zhong, ML Huang, HT Ma, W Dong
Intermetallics 79, 28-34, 2016
392016
Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111) Cu interface under temperature gradient
Y Zhong, N Zhao, CY Liu, W Dong, YY Qiao, YP Wang, HT Ma
Applied Physics Letters 111 (22), 2017
362017
Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect
N Zhao, Y Zhong, W Dong, ML Huang, HT Ma, CP Wong
Applied Physics Letters 110 (9), 2017
292017
In situ study on interfacial reactions of Cu/Sn–9Zn/Cu solder joints under temperature gradient
N Zhao, Y Zhong, ML Huang, W Dong, HT Ma, YP Wang
Journal of Alloys and Compounds 682, 1-6, 2016
262016
Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition
Y Zhong, N Zhao, HT Ma, W Dong, ML Huang
Journal of Alloys and Compounds 695, 1436-1443, 2017
242017
In situ study on Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient
Y Zhong, M Huang, H Ma, W Dong, Y Wang, N Zhao
Journal of Materials Research 31 (5), 609-617, 2016
202016
Abnormal intermetallic compound evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni micro solder joints under thermomigration
N Zhao, JF Deng, Y Zhong, ML Huang, HT Ma
Journal of Electronic Materials 46, 1931-1936, 2017
172017
Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn–0.7 Cu solder
N Zhao, ML Huang, Y Zhong, HT Ma, XM Pan
Journal of Materials Science: Materials in Electronics 26, 345-352, 2015
142015
Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding
Y Zhong, N Zhao, W Dong, H Ma, M Huang, L Yin, C Wong
Journal of Materials Research 32 (16), 3128-3136, 2017
92017
In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross-interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient
Y Zhong, N Zhao, W Dong, YP Wang, HT Ma
Materials Chemistry and Physics 216, 130-135, 2018
62018
Growth mechanism of Cu3Sn grains in the (111) Cu/Sn/Cu micro interconnects
Y Zhong, N Zhao, W Dong, Y Wang, H Ma
2018 19th International Conference on Electronic Packaging Technology (ICEPT …, 2018
42018
Effect of Zn content on interfacial reactions of Ni/Sn–xZn/Ni joints under temperature gradient
N Zhao, J Deng, Y Zhong, H Ma, Y Wang, C Wong
Journal of Materials Research 32 (18), 3555-3563, 2017
42017
微焊点中金属原子的热迁移及其对界面反应影响的研究进展
赵宁, 钟毅, 黄明亮, 马海涛
中国有色金属学报 25 (8), 2157-2166, 2015
42015
Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient
Y Zhong, N Zhao, HT Ma, W Dong, ML Huang, CP Wong
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 411-416, 2017
32017
Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu solder joints
Z Ning, Z Yi, H Ming-Liang, M Hai-Tao, L Xiao-Ping
Acta Physica Sinica 64 (16), 2015
32015
Interfacial reactions in Cu/Sn/Cu (Ni) systems during soldering under temperature gradient
N Zhao, Y Zhong, M Huang, H Ma
2015 16th International Conference on Electronic Packaging Technology (ICEPT …, 2015
22015
热迁移对 Cu/Sn/Cu 焊点液-固界面 Cu_6Sn_5 生长动力学的影响
赵宁, 钟毅, 黄明亮, 马海涛, 刘小平
物理学报, 344-353, 2015
22015
Formation of preferred orientation of Cu6Sn5grains in Cu/Sn/Cu interconnects by soldering under temperature gradient
Y Zhong, N Zhao, W Dong, H Ma, Y Wang, CP Wong
2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017
12017
Study on precipitation and dissolution of interfacial Cu6Sn5 during thermomigration
Y Zhong, M Huang, J Deng, H Ma, W Dong, N Zhao
2016 China Semiconductor Technology International Conference (CSTIC), 1-3, 2016
12016
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