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Lahouari Benabou
Lahouari Benabou
Prof., University of Versailles Paris-Saclay
Bestätigte E-Mail-Adresse bei uvsq.fr
Titel
Zitiert von
Zitiert von
Jahr
Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling
VN Le, L Benabou, V Etgens, QB Tao
Microelectronics Reliability, 2016
852016
A thermo-mechanical cohesive zone model for solder joint lifetime prediction
L Benabou, Z Sun, PR Dahoo
International Journal of Fatigue 49, 18-30, 2013
642013
Investigation of the heel crack mechanism in Al connections for power electronics modules
Y Celnikier, L Benabou, L Dupont, G Coquery
Microelectronics reliability 51 (5), 965-974, 2011
562011
Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints
QB Tao, L Benabou, L Vivet, VN Le, FB Ouezdou
Materials Science and Engineering: A 669, 403-416, 2016
522016
Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module
VN Le, L Benabou, QB Tao, V Etgens
International Journal of Solids and Structures 106, 1-12, 2017
482017
Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni
QB Tao, L Benabou, VN Le, H Hwang, DB Luu
Journal of Alloys and Compounds 694, 892-904, 2017
442017
Predictions of compressive strength and kink band orientation for wood species
L Benabou
Mechanics of materials 42 (3), 335-343, 2010
432010
Kink band formation in wood species under compressive loading
L Benabou
Experimental Mechanics 48, 647-656, 2008
372008
Comparative analysis of damage at interfaces of composites
L Benabou, N Benseddiq, M Naıt-Abdelaziz
Composites Part B: Engineering 33 (3), 215-224, 2002
332002
Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni
QB Tao, L Benabou, TAN Van, H Nguyen-Xuan
Journal of Alloys and Compounds 789, 183-192, 2019
262019
Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling
Z Sun, L Benabou, PR Dahoo
Engineering Fracture Mechanics 107, 48-60, 2013
252013
Systematic review of prosthetic socket fabrication using 3D printing
KT Nguyen, L Benabou, S Alfayad
Proceedings of the 2018 4th international conference on mechatronics and …, 2018
242018
Sodium dodecyl sulfate (SDS) as an effective corrosion inhibitor for Mg-8Li-3Al alloy in aqueous NaCl: A combined experimental and theoretical investigation
H Song, Z Xu, L Benabou, Z Yin, H Guan, H Yan, L Chao, Z Hu, X Wang
Journal of Magnesium and Alloys 11 (1), 287-300, 2023
192023
Development of LSTM networks for predicting viscoplasticity with effects of deformation, strain rate, and temperature history
L Benabou
Journal of Applied Mechanics 88 (7), 071008, 2021
192021
Effective properties of a composite with imperfectly bonded interface
L Benabou, MN Abdelaziz, N Benseddiq
Theoretical and Applied Fracture Mechanics 41 (1-3), 15-20, 2004
192004
Creep behavior of Innolot solder alloy using small lap-shear specimens
QB Tao, L Benabou, KL Tan, JM Morelle, F Ben Ouezdou
17th Electronics Packaging Technology Conference, 2015
182015
Optimization of wire connections design for power electronics
Y Celnikier, L Dupont, E Herve, G Coquery, L Benabou
Microelectronics Reliability 51 (9-11), 1892-1897, 2011
182011
CIGOS 2019, Innovation for Sustainable Infrastructure: Proceedings of the 5th International Conference on Geotechnics, Civil Engineering Works and Structures
C Ha-Minh, D Van Dao, F Benboudjema, S Derrible, DVK Huynh, ...
Springer Nature, 2019
172019
A design of a new miniature device for solder joints’ mechanical properties evaluation
QB Tao, L Benabou, L Vivet, KL Tan, JM Morelle, VN Le, F Ben Ouezdou
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of …, 2017
162017
Finite strain analysis of wood species under compressive failure due to kinking
L Benabou
International Journal of Solids and Structures 49 (3-4), 408-419, 2012
162012
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