| Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects N Chiodarelli, S Masahito, Y Kashiwagi, Y Li, K Arstila, O Richard, DJ Cott, ... Nanotechnology 22 (8), 085302, 2011 | 128 | 2011 |
| Correlation between number of walls and diameter in multiwall carbon nanotubes grown by chemical vapor deposition N Chiodarelli, O Richard, H Bender, M Heyns, S De Gendt, ... Carbon 50 (5), 1748-1752, 2012 | 81 | 2012 |
| Three-dimensional analysis of carbon nanotube networks in interconnects by electron tomography without missing wedge artifacts X Ke, S Bals, D Cott, T Hantschel, H Bender, G Van Tendeloo Microscopy and Microanalysis 16 (2), 210-217, 2010 | 81* | 2010 |
| Integration and electrical characterization of carbon nanotube via interconnects Y Li, DJ Cott, S Mertens, N Peys, M Heyns, S De Gendt, G Groeseneken, ... Microelectronic Engineering 88 (5), 837-843, 2011 | 78 | 2011 |
| Integration of vertical carbon nanotube bundles for interconnects N Chiodarelli, K Kellens, DJ Cott, N Peys, K Arstila, M Heyns, S De Gendt, ... Journal of The Electrochemical Society 157 (10), K211, 2010 | 37 | 2010 |
| Electrical characterization of CNT contacts with Cu Damascene top contact MH Van Der Veen, B Vereecke, C Huyghebaert, DJ Cott, M Sugiura, ... Microelectronic engineering 106, 106-111, 2013 | 36 | 2013 |
| Roll to roll coating of carbon nanotube films for electro thermal heating T Rashid, HL Liang, M Taimur, N Chiodarelli, HA Khawaja, K Edvardsen, ... Cold Regions Science and Technology 182, 103210, 2021 | 29 | 2021 |
| Carbon nanotubes horizontal interconnects with end-bonded contacts, diameters down to 50 nm and lengths up to 20 μm N Chiodarelli, A Fournier, H Okuno, J Dijon Carbon 60, 139-145, 2013 | 24 | 2013 |
| Alternative photoresist removal process to minimize damage of low-k material induced by ash plasma QT Le, J Keldermans, N Chiodarelli, E Kesters, M Lux, M Claes, ... Japanese journal of applied physics 47 (8S2), 6870, 2008 | 22 | 2008 |
| Impact of the contact's geometry on the line resistivity of carbon nanotubes bundles for applications as horizontal interconnects N Chiodarelli, A Fournier, J Dijon Applied Physics Letters 103 (5), 2013 | 17 | 2013 |
| ALD of Al2O3 for carbon nanotube vertical interconnect and its impact on the electrical properties N Chiodarelli, A Delabie, S Masahito, Y Kashiwagi, O Richard, H Bender, ... MRS Proceedings 1283, mrsf10-1283-b10-10, 2011 | 11* | 2011 |
| Growth mechanism of a hybrid structure consisting of a graphite layer on top of vertical carbon nanotubes N Chiodarelli, C Xu, O Richard, H Bender, A Klekachev, M Cooke, ... Journal of Nanomaterials 2012 (1), 130725, 2012 | 9 | 2012 |
| Carbon nanotube interconnects: Electrical characterization of 150 nm CNT contacts with Cu damascene top contact N Chiodarelli, MH van der Veen, B Vereecke, DJ Cott, G Groeseneken, ... 2011 IEEE International Interconnect Technology Conference, 1-3, 2011 | 8 | 2011 |
| High-throughput and consistent production of aqueous suspensions of single-wall carbon nanotubes N Chiodarelli, M De Volder Carbon 145, 757-763, 2019 | 7 | 2019 |
| Horizontal carbon nanotube interconnects for advanced integrated circuits. J Dijon, N Chiodarelli, A Fournier, H Okuno, R Ramos MRS Online Proceedings Library (OPL) 1559, mrss13-1559-aa02-01, 2013 | 6 | 2013 |
| Integration of carbon nanotubes as future interconnections for sub-32nm technologies N Chiodarelli | 6 | 2011 |
| Integration of vertical carbon nanotube bundles for interconnects N Chiodarelli, K Kellens, DJ Cott, N Peys, K Arstila, MM Heyns, ... ECS Transactions 19 (24), 11, 2009 | 4 | 2009 |
| CMP of novel materials P Ong, K Kellens, N Chiodarelli, M Meuris, P Leunissen | 3 | 2009 |
| Growth and integration of high-density CNT for BEOL interconnects A Romo Negreira, D Cott, A Verhulst, S Cruz Esconjaurequi, N Chiodarelli, ... | 3 | 2008 |
| A CMOS compatible carbon nanotube growth approach D Cott, M Sugiura, N Chiodarelli, K Arstila, PM Vereecken, B Vereecke, ... MRS Online Proceedings Library (OPL) 1284, mrsf10-1284-c04-11, 2011 | 2 | 2011 |
