Abhijit Dasgupta
Abhijit Dasgupta
Professor of Mechanical Engineering, University of Maryland
Bestätigte E-Mail-Adresse bei
Zitiert von
Zitiert von
Solder creep-fatigue analysis by an energy-partitioning approach
A Dasgupta, C Oyan, D Barker, M Pecht
Material failure mechanisms and damage models
A Dasgupta, M Pecht
IEEE Transactions on Reliability 40 (5), 531-536, 1991
Three-dimensional modeling of woven-fabric composites for effective thermo-mechanical and thermal properties
A Dasgupta, RK Agarwal, SM Bhandarkar
Composites science and technology 56 (3), 209-223, 1996
Physics-of-failure: an approach to reliable product development
M Pecht, A Dasgupta
Journal of the IES 38 (5), 30-34, 1995
Orthotropic thermal conductivity of plain-weave fabric composites using a homogenization technique
A Dasgupta, RK Agarwal
Journal of composite materials 26 (18), 2736-2758, 1992
Ultrasound-mediated drug delivery to the brain: principles, progress and prospects
A Dasgupta, M Liu, T Ojha, G Storm, F Kiessling, T Lammers
Drug Discovery Today: Technologies 20, 41-48, 2016
Role of failure-mechanism identification in accelerated testing
J Hu, D Barker, A Dasgupta, A Arora
Journal of the IES 36 (4), 39-45, 1993
Fibrosis imaging: current concepts and future directions
M Baues, A Dasgupta, J Ehling, J Prakash, P Boor, F Tacke, F Kiessling, ...
Advanced drug delivery reviews 121, 9-26, 2017
A fundamental overview of accelerated testing analytical models
H Caruso, A Dasgupta
Journal of the IEST 41 (1), 16-20, 1998
Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn3. 9Ag0. 6Cu solder alloy
Q Zhang, A Dasgupta, P Haswell
53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003
Failure-mechanism models for creep and creep rupture
J Li, A Dasgupta
IEEE Transactions on Reliability 42 (3), 339-353, 1993
The reliability physics approach to failure prediction modelling
M Pecht, A Dasgupta, D Barker, CT Leonard
Quality and Reliability Engineering International 6 (4), 267-273, 1990
Quality conformance and qualification of microelectronic packages and interconnects
M Pecht, A Dasgupta, JW Evans, JY Evans
John Wiley & Sons, 1994
PWB solder joint life calculations under thermal and vibrational loading
D Barker, A Dasgupta, M Peeht
Journal of the IES 35 (1), 17-25, 1992
Combined vibrational and thermal solder joint fatigue—A generalized strain versus life approach
D Barker, J Vodzak, A Dasgupta, M Pecht
Large-scale model test on square box culvert backfilled with sand
A Dasgupta, B Sengupta
Journal of Geotechnical Engineering 117 (1), 156-161, 1991
Systematic study on thermo-mechanical durability of Pb-free assemblies: Experiments and FE analysis
Q Zhang, A Dasgupta, D Nelson, H Pallavicini
Effective thermomechanical behavior of plain-weave fabric-reinforced composites using homogenization theory
A Dasgupta, SM Bhandarkar
Mechanistic model for the stress-strain response of double-layered PSA
H Huang, A Dasgupta
2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018
Importance of coatings to optical fiber sensors embedded in'smart'structures
A Dasgupta, JS Sirkis
AIAA journal 30 (5), 1337-1343, 1992
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