| Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient SB Liang, CB Ke, JQ Huang, MB Zhou, XP Zhang Microelectronics Reliability 92, 1-11, 2019 | 18 | 2019 |
| Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects SB Liang, CB Ke, WJ Ma, MB Zhou, XP Zhang Microelectronics Reliability 71, 71-81, 2017 | 16 | 2017 |
| Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3. 0Ag0. 5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing … JQ Huang, MB Zhou, SB Liang, XP Zhang Journal of Materials Science: Materials in Electronics 29, 7651-7660, 2018 | 15 | 2018 |
| PHASE-FIELD CRYSTAL SIMULATION ON EVOLU-TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM W MA, C KE, M ZHOU, S LIANG, X ZHANG Acta Metall Sin 51 (7), 873-882, 2015 | 10 | 2015 |
| Thermo-mechanical characteristics and reliability of die-attach through self-propagating exothermic reaction bonding S Liang, Y Zhong, S Robertson, A Liu, Z Zhou, C Liu IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 9 | 2021 |
| Insight into the preferential grain growth of intermetallics under electric current stressing–A phase field modeling S Liang, A Kunwar, C Wei, C Ke Scripta Materialia 203, 114071, 2021 | 8 | 2021 |
| Phase field modeling of grain boundary migration and preferential grain growth driven by electric current stressing SB Liang, CB Ke, C Wei, MB Zhou, XP Zhang Journal of Applied Physics 124 (17), 2018 | 8 | 2018 |
| Phase field simulation of segregation of the Bi-riched phase in Cu/Sn-Bi/Cu solder interconnects under electric current stressing SB Liang, CB Ke, WJ Ma, MB Zhou, XP Zhang 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 264-270, 2016 | 8 | 2016 |
| Study of the influence of elastic anisotropy of Cu on thermo-mechanical behavior and Cu protrusion of through silicon vias using combined phase field and finite element methods SB Liang, CB Ke, C Wei, MB Zhou, XP Zhang IEEE Transactions on Device and Materials Reliability 19 (2), 322-332, 2019 | 7 | 2019 |
| Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array H Jiang, S Robertson, S Liang, Z Zhou, L Zhao, C Liu Materials Letters 307, 131074, 2022 | 6 | 2022 |
| Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and … SB Liang, CB Ke, C Wei, JQ Huang, MB Zhou, XP Zhang Journal of Materials Research 34 (16), 2775-2788, 2019 | 6 | 2019 |
| Microstructure simulation and thermo-mechanical behavior analysis of copper filled through silicon vias using coupled phase field and finite element methods SB Liang, CB Ke, B Li, MB Zhou, XP Zhang 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1668-1674, 2017 | 6 | 2017 |
| Investigation of thermo-mechanical and phase-change behavior in the Sn/Cu interconnects during self-propagating exothermic reaction bonding S Liang, Y Zhong, S Robertson, A Liu, Z Zhou, C Liu 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 269-275, 2020 | 5 | 2020 |
| Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects SB Liang, CB Ke, MY Tan, MB Zhou, XP Zhang 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 5 | 2016 |
| Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation SB Liang, CB Ke, M Zhou, XP Zhang 2015 16th International Conference on Electronic Packaging Technology (ICEPT …, 2015 | 5 | 2015 |
| Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding Y Chen, S Liang, C Liu, C Liu, Z Zhou 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 451-459, 2021 | 4 | 2021 |
| Quasi-ambient bonding semiconductor components for power electronics integration Y Zhong, AY Liu, S Robertson, S Liang, C Liu, Z Zhou, C Liu 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1468-1473, 2020 | 4 | 2020 |
| An improved phase field method by using statistical learning theory-based optimization algorithm for simulation of martensitic transformation in NiTi alloy C Wei, CB Ke, SB Liang, S Cao, HT Ma, XP Zhang Computational Materials Science 172, 109292, 2020 | 4 | 2020 |
| Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration JY Zhou, C Wei, SB Liang, H Jiang, X Ma, XP Zhang 2018 19th International Conference on Electronic Packaging Technology (ICEPT …, 2018 | 4 | 2018 |
| Three-dimensional simulation of effects of microstructure evolution and interfacial delamination on Cu protrusion in copper filled through silicon vias by combined Monte Carlo … SB Liang, CB Ke, C Wei, MB Zhou, XP Zhang 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2134-2141, 2018 | 4 | 2018 |
Allan Y LiuUniversity of SheffieldBestätigte E-Mail-Adresse bei sheffield.ac.uk
