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Alexandra Efimovskaya
Alexandra Efimovskaya
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Bestätigte E-Mail-Adresse bei uci.edu
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Zitiert von
Zitiert von
Jahr
Electrostatic compensation of structural imperfections in dynamically amplified dual-mass gyroscope
E Alexandra, L Yu-Wei, W Danmeng, S Andrei M.
2017 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), 2017
37*2017
Dual foucault pendulum gyroscope
D Senkal, A Efimovskaya, AM Shkel
2015 Transducers-2015 18th International Conference on Solid-State Sensors …, 2015
232015
Origami-like 3-D folded MEMS approach for miniature inertial measurement unit
A Efimovskaya, YW Lin, AM Shkel
Journal of Microelectromechanical Systems 26 (5), 1030-1039, 2017
222017
Minimal realization of dynamically balanced lumped mass WA gyroscope: Dual foucault pendulum
D Senkal, A Efimovskaya, AM Shkel
2015 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL …, 2015
212015
On ordering of fundamental wineglass modes in toroidal ring gyroscope
A Efimovskaya, D Wang, YW Lin, AM Shkel
2016 IEEE SENSORS, 1-3, 2016
152016
Compact roll-pitch-yaw gyroscope implemented in wafer-level epitaxial silicon encapsulation process
A Efimovskaya, Y Yang, E Ng, Y Chen, I Flader, TW Kenny, AM Shkel
2017 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL …, 2017
132017
A comparative study of conventional single-mass and amplitude amplified dual-mass MEMS vibratory gyroscopes
D Wang, MH Asadian, A Efimovskaya, AM Shkel
2017 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL …, 2017
132017
Miniature origami-like folded MEMS TIMU
A Efimovskaya, D Senkal, AM Shkel
2015 Transducers-2015 18th International Conference on Solid-State Sensors …, 2015
112015
Mechanical trimming with focused ion beam for permanent tuning of MEMS dual-mass gyroscope
A Efimovskaya, D Wang, AM Shkel
Sensors and Actuators A: Physical 313, 112189, 2020
102020
Amplitude amplified dual-mass gyroscope: Design architecture and noise mitigation strategies
D Wang, A Efimovskaya, AM Shkel
2019 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL …, 2019
92019
Origami-like folded mems for realization of TIMU: fabrication technology and initial demonstration
A Efimovskaya, D Senkal, S Askari, AM Shkel
2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS …, 2015
92015
Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)
AA Shkel, A Efimovskaya
US Patent 9,611,138, 2017
82017
160 milli-ohm electrical resistance thru-wafer interconnects with 10: 1 Aspect ratio
A Efimovskaya, AM Shkel
International Symposium on Microelectronics 2014 (1), 000505-000510, 2014
72014
Multi-degree-of-freedom MEMS coriolis vibratory gyroscopes designed for dynamic range, robustness, and sensitivity
A Efimovskaya, AM Shkel
2018 DGON Inertial Sensors and Systems (ISS), 1-17, 2018
52018
O vliyanii nelineynykh faktorov na dinamiku mikromekhanicheskogo giroskopa s dvukhmassovym chuvstvitel’nym elementom [On the influence of nonlinear factors on the dynamics of …
AM Lestev, AV Efimovskaya
Izvestiya vysshikh uchebnykh zavedeniy. Priborostroenie–Journal of …, 2012
52012
Study of environmental survivability and stability of folded MEMS IMU
YW Lin, A Efimovskaya, AM Shkel
2017 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL …, 2017
42017
On cross-talk between gyroscopes integrated on a folded MEMS IMU Cube
A Efimovskaya, YW Lin, Y Yang, E Ng, Y Chen, I Flader, CH Ahn, V Hong, ...
2017 IEEE 30th International Conference on Micro Electro Mechanical Systems …, 2017
42017
Double-sided process for MEMS SOI sensors with deep vertical thru-wafer interconnects
A Efimovskaya, YW Lin, AM Shkel
Journal of Microelectromechanical Systems 27 (2), 239-249, 2018
32018
Thru-wafer interconnects for double-sided (TWIDS) fabrication of MEMS
A Efimovskaya, YW Lin, AM Shkel
2016 IEEE International Symposium on Inertial Sensors and Systems, 66-69, 2016
32016
Folded MEMS platform based on polymeric flexible hinges for 3D integration of spatially-distributed sensors
YW Lin, A Efimovskaya, AM Shkel
Journal of Microelectromechanical Systems 30 (6), 907-914, 2021
22021
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