| Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores Y Su, G Fu, C Liu, K Zhang, L Zhao, C Liu, A Liu, J Song Computer Methods in Applied Mechanics and Engineering 378, 113729, 2021 | 46 | 2021 |
| Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects C Liu, A Liu, Y Su, Y Chen, Z Zhou, C Liu Journal of Manufacturing Processes 73, 139-148, 2022 | 11 | 2022 |
| Thermo-mechanical characteristics and reliability of die-attach through self-propagating exothermic reaction bonding S Liang, Y Zhong, S Robertson, A Liu, Z Zhou, C Liu IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 10 | 2021 |
| Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging C Liu, A Liu, Y Su, Z Zhou, C Liu Microelectronics Reliability 126, 114241, 2021 | 9 | 2021 |
| Ultrasonic-assisted nano Ag-Al alloy sintering to enable high-temperature electronic interconnections C Liu, A Liu, Y Zhong, S Robertson, Z Zhou, C Liu 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1999-2004, 2020 | 9 | 2020 |
| Investigation of thermo-mechanical and phase-change behavior in the Sn/Cu interconnects during self-propagating exothermic reaction bonding S Liang, Y Zhong, S Robertson, A Liu, Z Zhou, C Liu 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 269-275, 2020 | 7 | 2020 |
| Quasi-ambient bonding semiconductor components for power electronics integration Y Zhong, AY Liu, S Robertson, S Liang, C Liu, Z Zhou, C Liu 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1468-1473, 2020 | 4 | 2020 |
| Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging C Liu, A Liu, H Jiang, S Liang, Z Zhou, C Liu Microelectronics Reliability 138, 114688, 2022 | 3 | 2022 |
| Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding S Liang, Y Zhong, S Robertson, A Liu, H Jiang, C Liu, Z Zhou, C Liu Microelectronics Reliability 138, 114654, 2022 | 2 | 2022 |
| Bonding with Zn-based solders through self-propagating exothermic reaction to enable high-temperature electronics packaging C Liu, H Jiang, S Liang, A Liu, Z Zhou, C Liu 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 439-442, 2022 | | 2022 |
| Low-temperature and rapid direct bonding through nano-Ag coating for high-temperature and high-power density electronics packaging C Liu, A Liu, Z Zhou, C Liu 2022 IEEE CPMT Symposium Japan (ICSJ), 29-32, 2022 | | 2022 |
