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Allan Y Liu
Allan Y Liu
Bestätigte E-Mail-Adresse bei sheffield.ac.uk
Titel
Zitiert von
Zitiert von
Jahr
Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores
Y Su, G Fu, C Liu, K Zhang, L Zhao, C Liu, A Liu, J Song
Computer Methods in Applied Mechanics and Engineering 378, 113729, 2021
322021
Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects
C Liu, A Liu, Y Su, Y Chen, Z Zhou, C Liu
Journal of Manufacturing Processes 73, 139-148, 2022
102022
Thermo-mechanical characteristics and reliability of die-attach through self-propagating exothermic reaction bonding
S Liang, Y Zhong, S Robertson, A Liu, Z Zhou, C Liu
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
92021
Ultrasonic-assisted nano Ag-Al alloy sintering to enable high-temperature electronic interconnections
C Liu, A Liu, Y Zhong, S Robertson, Z Zhou, C Liu
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1999-2004, 2020
82020
Investigation of thermo-mechanical and phase-change behavior in the Sn/Cu interconnects during self-propagating exothermic reaction bonding
S Liang, Y Zhong, S Robertson, A Liu, Z Zhou, C Liu
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 269-275, 2020
62020
Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging
C Liu, A Liu, Y Su, Z Zhou, C Liu
Microelectronics Reliability 126, 114241, 2021
52021
Quasi-ambient bonding semiconductor components for power electronics integration
Y Zhong, AY Liu, S Robertson, S Liang, C Liu, Z Zhou, C Liu
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1468-1473, 2020
42020
Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding
S Liang, Y Zhong, S Robertson, A Liu, H Jiang, C Liu, Z Zhou, C Liu
Microelectronics Reliability 138, 114654, 2022
12022
Bonding with Zn-based solders through self-propagating exothermic reaction to enable high-temperature electronics packaging
C Liu, H Jiang, S Liang, A Liu, Z Zhou, C Liu
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 439-442, 2022
2022
Low-temperature and rapid direct bonding through nano-Ag coating for high-temperature and high-power density electronics packaging
C Liu, A Liu, Z Zhou, C Liu
2022 IEEE CPMT Symposium Japan (ICSJ), 29-32, 2022
2022
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging
C Liu, A Liu, H Jiang, S Liang, Z Zhou, C Liu
Microelectronics Reliability 138, 114688, 2022
2022
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